Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6830959 | Semiconductor die package with semiconductor die having side electrical connection | — | 2004-12-14 |
| 6806580 | Multichip module including substrate with an array of interconnect structures | Rajeev Joshi | 2004-10-19 |
| 6777786 | Semiconductor device including stacked dies mounted on a leadframe | — | 2004-08-17 |