Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6790768 | Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects | David H. Mai, Kapila Wijekoon, Rajeev Bajaj, Rahul Surana, Yongqi Hu +6 more | 2004-09-14 |