Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6800218 | Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using same | Michael Jones, Thomas H. Baum, Deepak Verma, David Bernhard | 2004-10-05 |
| 6692546 | Chemical mechanical polishing compositions for metal and associated materials and method of using same | William A. Wojtczak, Cary Regulski, Thomas H. Baum, David Bernhard, Deepak Verma | 2004-02-17 |
| 6684917 | Apparatus for volumetric metering of small quantity of powder from fluidized beds | Jesse Zhu, Jianzhang Wen, Hui Zhang | 2004-02-03 |