Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6800218 | Abrasive free formulations for chemical mechanical polishing of copper and associated materials and method of using same | Ying Ma, Michael Jones, Thomas H. Baum, Deepak Verma | 2004-10-05 |
| 6773873 | pH buffered compositions useful for cleaning residue from semiconductor substrates | Ma. Fatima Seijo, William A. Wojtczak, Thomas H. Baum, David W. Minsek | 2004-08-10 |
| 6755989 | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate | William A. Wojtczak, Ma. Fatima Seijo, Long Nguyen | 2004-06-29 |
| 6692546 | Chemical mechanical polishing compositions for metal and associated materials and method of using same | Ying Ma, William A. Wojtczak, Cary Regulski, Thomas H. Baum, Deepak Verma | 2004-02-17 |