Issued Patents 2004
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6827252 | Bump manufacturing method | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +2 more | 2004-12-07 |
| 6812124 | Chip structure with bumps and a process for fabricating the same | — | 2004-11-02 |
| 6756256 | Method for preventing burnt fuse pad from further electrical connection | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2004-06-29 |
| 6743707 | Bump fabrication process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +3 more | 2004-06-01 |
| 6732912 | Solder ball attaching process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2004-05-11 |
| 6723630 | Solder ball fabrication process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +3 more | 2004-04-20 |
| 6720244 | Bump fabrication method | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2004-04-13 |
| 6720243 | Bump fabrication method | — | 2004-04-13 |
| 6716739 | Bump manufacturing method | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +2 more | 2004-04-06 |
| 6713320 | Bumping process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2004-03-30 |
| 6673711 | Solder ball fabricating process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +3 more | 2004-01-06 |