Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6649077 | Method and apparatus for removing coating layers from alignment marks on a wafer | Pang-Yen Tsai, Sen Yang, Wei-Cheng Ku | 2003-11-18 |
| 6561880 | Apparatus and method for cleaning the polishing pad of a linear polisher | Feng-Chih Hsu | 2003-05-13 |
| 6524959 | Chemical mechanical polish (CMP) planarizing method employing derivative signal end-point monitoring and control | Chen-Fa Lu, Chen-Peng Fan, Jui-Ping Chuang | 2003-02-25 |
| 6517413 | Method for a copper CMP endpoint detection system | Jin-Churng Twu, Chen-Fa Lu | 2003-02-11 |