Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6555477 | Method for preventing Cu CMP corrosion | Chin-Hsiung Ho, Mei-Ling Chen, Liang-Kun Huang | 2003-04-29 |
| 6524959 | Chemical mechanical polish (CMP) planarizing method employing derivative signal end-point monitoring and control | Chen-Peng Fan, Jui-Ping Chuang, Tien-Chen Hu | 2003-02-25 |
| 6517413 | Method for a copper CMP endpoint detection system | Tien-Chen Hu, Jin-Churng Twu | 2003-02-11 |