Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6541366 | Method for improving a solder bump adhesion bond to a UBM contact layer | Fang Liu, Chia-Jen Cheng, Hsiu-Mei Yu | 2003-04-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6541366 | Method for improving a solder bump adhesion bond to a UBM contact layer | Fang Liu, Chia-Jen Cheng, Hsiu-Mei Yu | 2003-04-01 |