Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6541366 | Method for improving a solder bump adhesion bond to a UBM contact layer | Shih-Ming Chin, Chia-Jen Cheng, Hsiu-Mei Yu | 2003-04-01 |
FL
Fang Liu
Overall (2003): #228,148 of 273,478Top 85%
1
Patents 2003