Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6624060 | Method and apparatus for pretreating a substrate prior to electroplating | Kuo-Feng Chen, Charles Tseng, Ta-Yang Lin | 2003-09-23 |
| 6593220 | Elastomer plating mask sealed wafer level package method | Ken-Shen Chou, Hsiu-Chieh Cheng, Shun-Liang Hsu | 2003-07-15 |
| 6541366 | Method for improving a solder bump adhesion bond to a UBM contact layer | Shih-Ming Chin, Fang Liu, Chia-Jen Cheng | 2003-04-01 |