Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6566239 | Semiconductor device manufacturing method having a step of forming a post terminal on a wiring by electroless plating | Eiji Watanabe, Hirohisa Matsuki, Tetsuya Fujisawa | 2003-05-20 |
| 6548898 | External connection terminal and semiconductor device | Hirohisa Matsuki, Masamitsu Ikumo, Mitsutaka Sato, Tetsuya Fujisawa, Yoshitaka Aiba | 2003-04-15 |
| 6522016 | Interconnection structure with film to increase adhesion of the bump | Toshiharu Egami, Eiji Watanabe | 2003-02-18 |