Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6627479 | Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer | Mitsutaka Sato, Toshio Hamano | 2003-09-30 |
| 6586273 | Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal | Mitsutaka Sato | 2003-07-01 |
| 6548898 | External connection terminal and semiconductor device | Hirohisa Matsuki, Yutaka Makino, Masamitsu Ikumo, Mitsutaka Sato, Tetsuya Fujisawa | 2003-04-15 |