Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6522016 | Interconnection structure with film to increase adhesion of the bump | Yutaka Makino, Eiji Watanabe | 2003-02-18 |
TE
Toshiharu Egami
Overall (2003): #101,978 of 273,478Top 40%
1
Patents 2003