Issued Patents 2003
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6666392 | Composition for substrate materials and process for the same as well as a heat conductive substrate and process for the same | Koichi Hirano, Hiroyuki Handa | 2003-12-23 |
| 6625037 | Printed circuit board and method manufacturing the same | Kouichi Hirano | 2003-09-23 |
| 6570099 | Thermal conductive substrate and the method for manufacturing the same | Koichi Hirano, Mitsuhiro Matsuo, Hiroyuki Handa, Yoshihisa Yamashita | 2003-05-27 |
| 6548152 | Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same | Hiroyuki Handa | 2003-04-15 |
| 6538210 | Circuit component built-in module, radio device having the same, and method for producing the same | Yasuhiro Sugaya, Koichi Hirano, Yasuyuki Matsuoka, Satoru Yuuhaku, Toshiyuki Asahi | 2003-03-25 |
| 6525921 | Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same | Koichi Hirano, Mikinari Shimada, Yasuhiro Sugaya | 2003-02-25 |
| 6522555 | Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein | Koichi Hirano, Mitsuhiro Matsuo, Yoshihisa Yamashita | 2003-02-18 |
| 6504705 | Electrolytic capacitor, circuit board containing electrolytic capacitor, and method for producing the same | Mikinari Shimada, Yasuhiko Nakada, Seigo Shiraishi, Hiroyuki Handa, Akihiro Ishikawa | 2003-01-07 |