Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6666392 | Composition for substrate materials and process for the same as well as a heat conductive substrate and process for the same | Koichi Hirano, Seiichi Nakatani | 2003-12-23 |
| 6642483 | High-speed CO2 gas welding method | Yasuhiro Koga, Shinji Okumura, Haruki Nakashima, Takafumi Mitsushio | 2003-11-04 |
| 6639471 | Power amplifier circuit, control method for power amplifier circuit, and portable terminal apparatus for mobile communication | Toru Matsuura, Hisashi Adachi, Makoto Sakakura, Toshio Obara | 2003-10-28 |
| 6570099 | Thermal conductive substrate and the method for manufacturing the same | Koichi Hirano, Seiichi Nakatani, Mitsuhiro Matsuo, Yoshihisa Yamashita | 2003-05-27 |
| 6548152 | Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same | Seiichi Nakatani | 2003-04-15 |
| 6504705 | Electrolytic capacitor, circuit board containing electrolytic capacitor, and method for producing the same | Mikinari Shimada, Yasuhiko Nakada, Seiichi Nakatani, Seigo Shiraishi, Akihiro Ishikawa | 2003-01-07 |