Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6666392 | Composition for substrate materials and process for the same as well as a heat conductive substrate and process for the same | Seiichi Nakatani, Hiroyuki Handa | 2003-12-23 |
| 6570099 | Thermal conductive substrate and the method for manufacturing the same | Seiichi Nakatani, Mitsuhiro Matsuo, Hiroyuki Handa, Yoshihisa Yamashita | 2003-05-27 |
| 6538210 | Circuit component built-in module, radio device having the same, and method for producing the same | Yasuhiro Sugaya, Seiichi Nakatani, Yasuyuki Matsuoka, Satoru Yuuhaku, Toshiyuki Asahi | 2003-03-25 |
| 6525921 | Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same | Seiichi Nakatani, Mikinari Shimada, Yasuhiro Sugaya | 2003-02-25 |
| 6522555 | Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein | Seiichi Nakatani, Mitsuhiro Matsuo, Yoshihisa Yamashita | 2003-02-18 |