Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6562250 | Method for manufacturing wiring circuit boards with bumps and method for forming bumps | Keiichi Naito, Toshihiro Shinohara | 2003-05-13 |
| 6553122 | Method and apparatus for multi-channel acoustic echo cancellation and recording medium with the method recorded thereon | Suehiro Shimauchi, Yoichi Haneda, Shoji Makino | 2003-04-22 |
| 6518510 | Bump-attached wiring circuit board and method for manufacturing same | Keiichi Naito, Soichiro Kishimoto, Toshihiro Shinohara | 2003-02-11 |