Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6562250 | Method for manufacturing wiring circuit boards with bumps and method for forming bumps | Yutaka Kaneda, Toshihiro Shinohara | 2003-05-13 |
| 6518510 | Bump-attached wiring circuit board and method for manufacturing same | Yutaka Kaneda, Soichiro Kishimoto, Toshihiro Shinohara | 2003-02-11 |