Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6653736 | Multilayer flexible wiring boards | Hiroyuki Hishinuma | 2003-11-25 |
| 6570098 | Printed wiring board and method for producing the same | Kazuhiro Shimizu, Nobuo Komatsu | 2003-05-27 |
| 6524892 | Method of fabricating multilayer flexible wiring boards | Hiroyuki Hishinuma | 2003-02-25 |
| 6518510 | Bump-attached wiring circuit board and method for manufacturing same | Yutaka Kaneda, Keiichi Naito, Toshihiro Shinohara | 2003-02-11 |