Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660628 | Method of MOCVD Ti-based barrier metal thin films with tetrakis (methylethylamino) titanium with octane | Wei-Wei Zhuang, David R. Evans, Sheng Teng Hsu | 2003-12-09 |
| 6654210 | Solid-state inductor and method for same | Sheng Teng Hsu, Wei-Wei Zhuang | 2003-11-25 |
| 6642138 | Process of making dual damascene structures using a sacrificial polymer | Sheng Teng Hsu | 2003-11-04 |
| 6579793 | Method of achieving high adhesion of CVD copper thin films on TaN Substrates | Wei-Wei Zhuang, David R. Evans, Sheng Teng Hsu | 2003-06-17 |
| 6555467 | Method of making air gaps copper interconnect | Sheng Teng Hsu | 2003-04-29 |
| 6548849 | Magnetic yoke structures in MRAM devices to reduce programming power consumption and a method to make the same | Sheng Teng Hsu | 2003-04-15 |
| 6509268 | Thermal densification in the early stages of copper MOCVD for depositing high quality Cu films with good adhesion and trench filling characteristics | David R. Evans, Sheng Teng Hsu | 2003-01-21 |