Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664615 | Method and apparatus for lead-frame based grid array IC packaging | Anindya Poddar | 2003-12-16 |
| 6617197 | Multi row leadless leadframe package | Peter Howard Spalding | 2003-09-09 |
| 6576989 | Locking of mold compound to conductive substrate panels | Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Sharon Ko Mei Wan, Chan Peng Yeen +1 more | 2003-06-10 |
| 6551048 | Off-load system for semiconductor devices | Peter Howard Spalding | 2003-04-22 |