Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6576989 | Locking of mold compound to conductive substrate panels | Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Chan Peng Yeen, Jaime A. Bayan +1 more | 2003-06-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6576989 | Locking of mold compound to conductive substrate panels | Harry Kam Cheng Hong, Hu Ah Lek, Santhiran Nadarajah, Chan Peng Yeen, Jaime A. Bayan +1 more | 2003-06-10 |