Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664615 | Method and apparatus for lead-frame based grid array IC packaging | Jaime A. Bayan | 2003-12-16 |
| 6607941 | Process and structure improvements to shellcase style packaging technology | Ashok S. Prabhu, Nikhil Kelkar | 2003-08-19 |
| 6603199 | Integrated circuit package having die with staggered bond pads and die pad assignment methodology for assembly of staggered die in single-tier ebga packages | — | 2003-08-05 |
| 6509635 | Integrated circuit package having offset die | — | 2003-01-21 |