Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6530764 | Mold for resin-sealing of semiconductor devices | Tetsuya Hirose, Hideji Aoki, Hiromichi Yamada, Toru Ueno, Kiyoharu Kato | 2003-03-11 |
YM
Yoshiyuki Mishima
Overall (2003): #86,419 of 273,478Top 35%
1
Patents 2003