Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6530764 | Mold for resin-sealing of semiconductor devices | Yoshiyuki Mishima, Tetsuya Hirose, Hiromichi Yamada, Toru Ueno, Kiyoharu Kato | 2003-03-11 |
HA
Hideji Aoki
Overall (2003): #213,397 of 273,478Top 80%
1
Patents 2003