Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6530764 | Mold for resin-sealing of semiconductor devices | Yoshiyuki Mishima, Tetsuya Hirose, Hideji Aoki, Hiromichi Yamada, Toru Ueno | 2003-03-11 |
KK
Kiyoharu Kato
Overall (2003): #178,343 of 273,478Top 70%
1
Patents 2003