Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656769 | Method and apparatus for distributing mold material in a mold for packaging microelectronic devices | Kian Lee, Vijendran M, Lien Wah Choong | 2003-12-02 |
TT
Teoh Bee Yong Tim
Overall (2003): #106,514 of 273,478Top 40%
1
Patents 2003