Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656769 | Method and apparatus for distributing mold material in a mold for packaging microelectronic devices | Kian Lee, Teoh Bee Yong Tim, Vijendran M | 2003-12-02 |
LC
Lien Wah Choong
Overall (2003): #171,743 of 273,478Top 65%
1
Patents 2003