Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656769 | Method and apparatus for distributing mold material in a mold for packaging microelectronic devices | Teoh Bee Yong Tim, Vijendran M, Lien Wah Choong | 2003-12-02 |
| 6583502 | Apparatus for package reduction in stacked chip and board assemblies | Teck Kheng Lee | 2003-06-24 |