Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6670819 | Methods of engaging electrically conductive pads on a semiconductor substrate | Warren M. Farnworth, Gurtej S. Sandhu | 2003-12-30 |
| 6657450 | Methods of engaging electrically conductive test pads on a semiconductor substrate removable electrical interconnect apparatuses, engagement probes and removable engagement probes | Warren M. Farnworth, Gurtej S. Sandhu | 2003-12-02 |
| 6614249 | Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate | Warren M. Farnworth, Gurtej S. Sandhu | 2003-09-02 |
| 6573740 | Method of forming an apparatus configured to engage an electrically conductive pad on a semiconductive substrate and a method of engaging electrically conductive pads on a semiconductive substrate | Warren M. Farnworth, Gurtej S. Sandhu | 2003-06-03 |
| 6555466 | Two-step chemical-mechanical planarization for damascene structures on semiconductor wafers | Thomas Laursen, Krishna P. Murella, Sanjay Basak | 2003-04-29 |