Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6617201 | U-shape tape for BOC FBGA package to improve moldability | Lim Thiam Chye, Jeffrey Toh, Tim Teoh, Patrick Guay, Choong L. Wah | 2003-09-09 |
| 6507114 | BOC semiconductor package including a semiconductor die and a substrate bonded circuit side down to the die | Chong Chin Hui, Lee Kian Chai | 2003-01-14 |