Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6650013 | Method of manufacturing wire bonded microelectronic device assemblies | Leng Nam Yin | 2003-11-18 |
| 6617201 | U-shape tape for BOC FBGA package to improve moldability | Lee Choon Kuan, Jeffrey Toh, Tim Teoh, Patrick Guay, Choong L. Wah | 2003-09-09 |