Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6638792 | Method for fabricating BOC semiconductor package | Chong Chin Hui, Lee Choon Kian | 2003-10-28 |
| 6507114 | BOC semiconductor package including a semiconductor die and a substrate bonded circuit side down to the die | Chong Chin Hui, Lee Choon Kuan | 2003-01-14 |