Issued Patents 2003
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6512302 | Apparatus and methods of packaging and testing die | Leonard E. Mess, David J. Corisis, Walter L. Moden | 2003-01-28 |
| 6511863 | Method and apparatus for a semiconductor package for vertical surface mounting | Warren M. Farnworth, Walter L. Moden | 2003-01-28 |
| 6507109 | Vertical surface mount package utilizing a back-to-back semiconductor device module | — | 2003-01-14 |
| 6506629 | Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages | Jerry M. Brooks | 2003-01-14 |