Issued Patents 2003
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6657370 | Microcavity discharge device | — | 2003-12-02 |
| 6630713 | Low temperature silicon wafer bond process with bulk material bond strength | — | 2003-10-07 |
| 6602653 | Conductive material patterning methods | Alan R. Reinberg | 2003-08-05 |
| 6593656 | Multilevel copper interconnects for ultra large scale integration | Kie Y. Ahn | 2003-07-15 |
| 6582512 | Method of forming three-dimensional photonic band structures in solid materials | Kevin G. Donohoe | 2003-06-24 |
| 6579803 | Removal of copper oxides from integrated interconnects | Alan R. Reinberg | 2003-06-17 |
| 6579738 | Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materials | Paul A. Farrar | 2003-06-17 |
| 6545314 | Memory using insulator traps | Leonard Forbes | 2003-04-08 |
| 6526191 | Integrated circuits using optical fiber interconnects formed through a semiconductor wafer and methods for forming same | Kie Y. Ahn, Leonard Forbes | 2003-02-25 |
| 6518615 | Method and structure for high capacitance memory cells | Leonard Forbes, Kie Y. Ahn | 2003-02-11 |