Issued Patents 2003
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6518650 | Tape under frame for lead frame IC package assembly | Larry D. Kinsman, Jerry M. Brooks | 2003-02-11 |
| 6515359 | Lead frame decoupling capacitor semiconductor device packages including the same and methods | Chris G. Martin | 2003-02-04 |
| 6512302 | Apparatus and methods of packaging and testing die | Leonard E. Mess, Walter L. Moden, Larry D. Kinsman | 2003-01-28 |
| 6509632 | Method of fabricating a redundant pinout configuration for signal enhancement in an IC package | — | 2003-01-21 |
| 6507094 | Die paddle clamping for wire bond enhancement | — | 2003-01-14 |
| 6505400 | Method of making chip scale package with heat spreader | — | 2003-01-14 |