Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6642137 | Method for manufacturing a package structure of integrated circuits | Chen Peng, Jichen Wu | 2003-11-04 |
| 6642554 | Memory module structure | Chen Peng, Chief Lin, C. Cheng, Kuang-Yu Fan, Ren Long Kau +5 more | 2003-11-04 |
| 6627983 | Stacked package structure of image sensor | Hsiu-Wen Tu, Wen-Chuan Chen, Mon Ho, Li Huan Chen, Yen-Cheng Huang +4 more | 2003-09-30 |
| 6565008 | Module card and a method for manufacturing the same | Mon Ho, Hsiu-Wen Tu, Kuo Feng Feng, Yung-Sheng Chiu, Joe Liu +2 more | 2003-05-20 |
| 6559539 | Stacked package structure of image sensor | Hsiu-Wen Tu, Wen-Chuan Chen, Mon Ho, Li Huan Chen, Yen-Cheng Huang +2 more | 2003-05-06 |