Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6642137 | Method for manufacturing a package structure of integrated circuits | Nai Hua Yeh, Jichen Wu | 2003-11-04 |
| 6642554 | Memory module structure | Nai Hua Yeh, Chief Lin, C. Cheng, Kuang-Yu Fan, Ren Long Kau +5 more | 2003-11-04 |