Issued Patents 2003
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6649834 | Injection molded image sensor and a method for manufacturing the same | Jackson Hsieh, Bruce Chen, Kevin Chang | 2003-11-18 |
| 6646316 | Package structure of an image sensor and packaging | Hsiu-Wen Tu, Kuo-Feng Peng, C. H. Chen, Wen-Chuan Chen | 2003-11-11 |
| 6642137 | Method for manufacturing a package structure of integrated circuits | Nai Hua Yeh, Chen Peng | 2003-11-04 |
| 6638097 | Probe structure | Burton B. Yang | 2003-10-28 |
| 6627983 | Stacked package structure of image sensor | Hsiu-Wen Tu, Wen-Chuan Chen, Mon Ho, Li Huan Chen, Nai Hua Yeh +4 more | 2003-09-30 |
| 6590269 | Package structure for a photosensitive chip | Jason Chuang, Allis Chen, Jachson Hsieh, Hsiu-Wen Tu, Meng-Ru Tsai +4 more | 2003-07-08 |
| 6559539 | Stacked package structure of image sensor | Hsiu-Wen Tu, Wen-Chuan Chen, Mon Ho, Li Huan Chen, Nai Hua Yeh +2 more | 2003-05-06 |
| 6521881 | Stacked structure of an image sensor and method for manufacturing the same | Hsiu-Wen Tu, Wen-Chuan Chen, Mon Ho, Li Huan Chen, Meng-Ru Tsai | 2003-02-18 |