Issued Patents 2003
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6657306 | Paste including a mixture of powders, connection plug, burying method, and semiconductor device manufacturing method | Keiichi Sasaki, Manabu Kimura, Yoshimi Hisatsune | 2003-12-02 |
| 6632335 | Plating apparatus | Junji Kunisawa, Mitsuko Odagaki, Natsuki Makino, Koji Mishima, Kenji Nakamura +7 more | 2003-10-14 |
| 6614106 | Stacked circuit device and method for evaluating an integrated circuit substrate using the stacked circuit device | Mie Matsuo | 2003-09-02 |
| 6608356 | Semiconductor device using damascene technique and manufacturing method therefor | Yusuke Kohyama, Katsuya Okumura | 2003-08-19 |
| 6566632 | Hot plate and semiconductor device manufacturing method using the same | Tomio Katata, Katsuya Okumura | 2003-05-20 |
| 6566261 | Semiconductor device and method of manufacturing the same | Hiroshi Ikegami, Rempei Nakata, Takashi Yoda, Yoshimi Hisatsune | 2003-05-20 |
| 6538323 | Semiconductor device having an electrode structure comprising a conductive fine particle film | Atsuko Sakata, Keiichi Sasaki, Katsuya Okumura, Hirotaka Nishino | 2003-03-25 |
| 6504227 | Passive semiconductor device mounted as daughter chip on active semiconductor device | Mie Matsuo, Noriaki Matsunaga, Katsuya Okumura | 2003-01-07 |