Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6644536 | Solder reflow with microwave energy | Glenn Ratificar, Carlos Gonzalez | 2003-11-11 |
| 6570029 | No-flow reworkable epoxy underfills for flip-chip applications | Haiying Li, Ching-Ping Wong | 2003-05-27 |