Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6570029 | No-flow reworkable epoxy underfills for flip-chip applications | Lejun Wang, Haiying Li | 2003-05-27 |
| 6544651 | High dielectric constant nano-structure polymer-ceramic composite | Yang Rao | 2003-04-08 |