Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6657131 | I/C package / thermal-solution retention mechanism with spring effect | Leo Ofman | 2003-12-02 |
| 6644536 | Solder reflow with microwave energy | Glenn Ratificar, Lejun Wang | 2003-11-11 |
| 6600652 | Package retention module coupled directly to a socket | Biju Chandran | 2003-07-29 |