Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6621151 | Lead frame for an integrated circuit chip | Tai Chong Chai, Yong Chua Teo, James Tan, Raymundo M. Camenforte, Eric Neo +1 more | 2003-09-16 |
| 6583501 | Lead frame for an integrated circuit chip (integrated circuit peripheral support) | Tai Chong Chai, Yong Chua Teo, James Tan, Ray Camenforte, Eric Neo +1 more | 2003-06-24 |
| 6540866 | Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate | Junfeng Zhang, Cheng Qiang Cui, En-Tang Kang | 2003-04-01 |
| 6537411 | Method for low temperature lamination of metals to polyimides | En-Tang Kang, Arthur Ang, Koon Gee Neoh, Cheng Qiang Cui | 2003-03-25 |