Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6540866 | Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate | Junfeng Zhang, Thiam B. Lim, En-Tang Kang | 2003-04-01 |
| 6537411 | Method for low temperature lamination of metals to polyimides | En-Tang Kang, Arthur Ang, Koon Gee Neoh, Thiam B. Lim | 2003-03-25 |