Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6621151 | Lead frame for an integrated circuit chip | Tai Chong Chai, Thiam B. Lim, Yong Chua Teo, James Tan, Eric Neo +1 more | 2003-09-16 |
| 6617525 | Molded stiffener for flexible circuit molding | John Briar | 2003-09-09 |
| 6544812 | Single unit automated assembly of flex enhanced ball grid array packages | John Briar | 2003-04-08 |
| 6537848 | Super thin/super thermal ball grid array package | Dioscoro A. Merilo, Seng Guan Chow | 2003-03-25 |
| 6535004 | Testing of BGA and other CSP packages using probing techniques | Rajiv Mehta, Liop-Jin Yap, Chee Keong Tan | 2003-03-18 |