Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660565 | Flip chip molded/exposed die process and package structure | — | 2003-12-09 |
| 6617525 | Molded stiffener for flexible circuit molding | Raymundo M. Camenforte | 2003-09-09 |
| 6543127 | Coplanarity inspection at the singulation process | Antonio B. Dimaano, Jr., Weddie Aquien | 2003-04-08 |
| 6544812 | Single unit automated assembly of flex enhanced ball grid array packages | Raymundo M. Camenforte | 2003-04-08 |
| 6537857 | Enhanced BGA grounded heatsink | Weddie Aquien, Setho Sing Fee | 2003-03-25 |