MR

Martin Reiss

Infineon Technologies Ag: 2 patents #154 of 897Top 20%
📍 Sinzing, DE: #2 of 3 inventorsTop 70%
Overall (2003): #52,965 of 273,478Top 20%
2
Patents 2003

Issued Patents 2003

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6664648 Apparatus for applying a semiconductor chip to a carrier element with a compensating layer Johann Winderl, Christian Hauser 2003-12-16
6525416 Electronic devices and a sheet strip for packaging bonding wire connections of electronic devices and method for producing them Christian Hauser, Johann Winderl 2003-02-25