JW

Johann Winderl

Infineon Technologies Ag: 5 patents #35 of 897Top 4%
📍 Wackersdorf, DE: #1 of 2 inventorsTop 50%
Overall (2003): #9,444 of 273,478Top 4%
5
Patents 2003

Issued Patents 2003

Showing 1–5 of 5 patents

Patent #TitleCo-InventorsDate
6664648 Apparatus for applying a semiconductor chip to a carrier element with a compensating layer Christian Hauser, Martin Reiss 2003-12-16
6614100 Lead frame for the installation of an integrated circuit in an injection-molded package Christian Hauser, Helge Schmidt 2003-09-02
6534345 Method for mounting a semiconductor chip on a carrier layer and device for carrying out the method Simon Muff, Jens Pohl 2003-03-18
6525416 Electronic devices and a sheet strip for packaging bonding wire connections of electronic devices and method for producing them Christian Hauser, Martin Reiss 2003-02-25
6521988 Device for packaging electronic components Christian Hauser, Jens Pohl 2003-02-18