Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664648 | Apparatus for applying a semiconductor chip to a carrier element with a compensating layer | Johann Winderl, Martin Reiss | 2003-12-16 |
| 6614100 | Lead frame for the installation of an integrated circuit in an injection-molded package | Helge Schmidt, Johann Winderl | 2003-09-02 |
| 6541311 | Method of positioning a component mounted on a lead frame in a test socket | Ulrich Vidal, Harald Widner | 2003-04-01 |
| 6525416 | Electronic devices and a sheet strip for packaging bonding wire connections of electronic devices and method for producing them | Johann Winderl, Martin Reiss | 2003-02-25 |
| 6521988 | Device for packaging electronic components | Johann Winderl, Jens Pohl | 2003-02-18 |